You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.


    Adhesion of Thick Films to Ceramic and Its Measurement by Both Destructive and Nondestructive Means

    Published: 0

      Format Pages Price  
    PDF (460K) 18 $25   ADD TO CART
    Complete Source PDF (9.1M) 401 $108   ADD TO CART


    Techniques for the measurement of adhesion of thick films to alumina have been evaluated. One method is to solder a connection into a thick film pad and measure strength using a force gage. By this method it is not possible to differentiate between inherent adhesion problems and soldering effects. Another method is to use a wire peel test, but it requires optimized procedures or the effects of soldering can mask the adhesion characteristics. Metallurgical sectioning with use of a scanning electron microscope (SEM) and energy dispersive X-ray (EDAX) attachment is an invaluable aid for examining the interface and determining the characteristics of glass and metal components. Bondability tests are also a means of evaluating adhesion but are affected by bonding technique and wire size. Standardized methods are needed for adhesion measurements which, coupled with a comprehensive quality-assurance procedure, can give full process control.


    adhesion, thick films, tests, evaluation, bondability, quality control, substrates, dielectrics, measuring instruments

    Author Information:

    Morey, RL

    Committee/Subcommittee: C24.30

    DOI: 10.1520/STP38635S