SYMPOSIA PAPER Published: 01 January 1983
STP36187S

Automated Detection of Wafer Surface Defects by Laser Scanning

Source

Several systems are presently being marketed that automatically detect and map surface defects on unpatterned wafers by means of light scattering. Applications of these wafer inspection systems in process control and incoming inspection are described. Systems based on scanned laser beams, discussed here in detail, have considerably higher dynamic range and give more reproducible results with non-isotropically-scattering defects than systems using television cameras.

Author Information

Galbraith, LK
Tencor Instruments, Mountain View, Calif.
Price: $25.00
Contact Sales
Related
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Details
Developed by Committee: F01
Pages: 492–500
DOI: 10.1520/STP36187S
ISBN-EB: 978-0-8031-4871-0
ISBN-13: 978-0-8031-0243-9