You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.

    If you are an ASTM Compass Subscriber and this document is part of your subscription, you can access it for free at ASTM Compass

    Automated Detection of Wafer Surface Defects by Laser Scanning

    Published: 01 January 1983

      Format Pages Price  
    PDF (164K) 9 $25   ADD TO CART
    Complete Source PDF (9.3M) 555 $66   ADD TO CART

    Cite this document

    X Add email address send
      .RIS For RefWorks, EndNote, ProCite, Reference Manager, Zoteo, and many others.   .DOCX For Microsoft Word


    Several systems are presently being marketed that automatically detect and map surface defects on unpatterned wafers by means of light scattering. Applications of these wafer inspection systems in process control and incoming inspection are described. Systems based on scanned laser beams, discussed here in detail, have considerably higher dynamic range and give more reproducible results with non-isotropically-scattering defects than systems using television cameras.


    surface defects, light scattering, scanned-laser systems, automated inspection

    Author Information:

    Galbraith, LK
    Senior Scientist, Tencor Instruments, Mountain View, Calif.

    Committee/Subcommittee: F01.02

    DOI: 10.1520/STP36187S