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    STP804

    Considerations of Resist Processing

    Published: 01 January 1983


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    Abstract

    Resist processing is taken here to refer to the variety of steps performed on the resist pursuant to defect-free pattern delineation. These processing steps include spin coating, pre-baking, exposure, post-exposure curing, development, and post-development treatment (post-baking, plasma de-scumming, etc.). Not all of these processing steps are necessarily performed, since the particular processing steps chosen, together with their operational sequence, are dictated by the chemical and physical properties of the resist. This paper discusses some of the considerations pertinent to process optimization of several electron resists and shows how processing relates to sensitivity, resolution, and defect levels.

    Keywords:

    resist processing, pattern processing, pattern delineation, electron resist, defects in patterns, photo resists


    Author Information:

    Bowden, MJ
    Bell Laboratories, Murray Hill, N.J.

    Frackoviak, J
    Bell Laboratories, Murray Hill, N.J.


    Committee/Subcommittee: F01.06

    DOI: 10.1520/STP36163S