You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.

    If you are an ASTM Compass Subscriber and this document is part of your subscription, you can access it for free at ASTM Compass
    STP631

    Stress Intensities for Cracks Emanating from Pin-Loaded Holes

    Published: 01 January 1977


      Format Pages Price  
    PDF (204K) 12 $25   ADD TO CART
    Complete Source PDF (7.6M) 532 $157   ADD TO CART

    Cite this document

    X Add email address send
    X
      .RIS For RefWorks, EndNote, ProCite, Reference Manager, Zoteo, and many others.   .DOCX For Microsoft Word


    Abstract

    A series of stress freezing photoelastic experiments were conducted on large plates containing central holes with cracks emanating from the edge formed by the intersection of the hole with the plate surface. Loads were applied through rigid pins with neat fits in the holes. Stress-intensity factors (SIF) were estimated by a computer assisted least squares analysis of the photoelastic data taken from slices near the points of intersection of the flaw border with the hole boundary and the plate surface. Results indicate that the local mode of loading changes from Mode I near the hole boundary to mixed mode near the plate surface. The analysis is extended to include mixed mode loading, and results are compared with an existing approximate theory.

    Keywords:

    crack propagation, photoelasticity, fracture mechanics, stress intensity factors, fractures (materials), stresses


    Author Information:

    Smith, CW
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.

    Jolles, M
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.

    Peters, WH
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.


    Committee/Subcommittee: E08.08

    DOI: 10.1520/STP35540S