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    Lifetime Prediction for Hot-Pressed Silicon Nitride at High Temperatures

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    Four-point bend specimens of hot-pressed silicon nitride were tested at 1000 and 1200°C at constant displacement rates and with constant applied load. At all temperatures the relationship between failure probability and time to failure could be predicted for the tests with constant load from the test performed at constant displacement rate, using the relations of linear elastic fracture mechanics. Regarding the test at 1200°C, the varying stresses due to creep have to be taken into account in the predictions.


    silicon nitride, crack propagation, lifetime prediction, creep, scatter, structural reliability, brittle materials

    Author Information:

    Fett, T
    Research engineer, Kernforschungszentrum Karlsruhe, Arbeitsgruppe Zuverlässigkeit und Schadenskunde am Institut für Reaktorbauelemente,

    Munz, D
    Professor, Universität Karlsruhe, Institut für Zuverlässigkeit und Schadenskunde im Maschinenbau,

    Committee/Subcommittee: E08.08

    DOI: 10.1520/STP35243S