You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.


    Solder Bloom Corrosion Analysis Based on Field Survey Data, Potential Causes, and Resolution

    Published: 0

      Format Pages Price  
    PDF (560K) 21 $25   ADD TO CART
    Complete Source PDF (6.1M) 292 $64   ADD TO CART

    Cite this document

    X Add email address send
      .RIS For RefWorks, EndNote, ProCite, Reference Manager, Zoteo, and many others.   .DOCX For Microsoft Word


    A method to analyze field survey data on the solder bloom corrosion in copper/brass radiators is presented. In an effort to distinguish various manufacturers' radiator products according to their solder bloom corrosion performance, a corrosion index number is introduced (Park's Solder Bloom Corrosion Index). Using this technique, the solder bloom corrosion susceptibility of various manufacturers' radiators can be forceranked as a function of miles-in-service and months-in-service.

    Potential causes for the solder bloom corrosion in the copper/brass radiators are analyzed from the standpoint of coolant type used, solder type used, different soldering processes, various internal rinse systems, and so forth. Based on the data analysis, a number of recommendations are presented for the potential resolution of solder bloom corrosion.


    solder bloom corrosion, field survey data, copper/brass radiator, corrosion index number, Park's Solder Bloom Corrosion Index, force-rank, miles-in-service, months-in-service, coolant, solder, soldering process, internal rinse system

    Author Information:

    Park, KH
    Engineering supervisor, Product Engineering Office, Climate Control Division, Ford Motor Co., Dearborn, MI

    Committee/Subcommittee: D15.21

    DOI: 10.1520/STP32978S