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Scheduling ultrasonic bonders for optimum settings has long been a mystery. As device bond pads get smaller and silicon and gallium arsenide devices get thinner, ultrasonic energy control at the bond interface becomes very critical. The use of a capacitive microphone sound meter to measure the compressional sound waves at the lower tip of a bonding tool has helped to control these critical energy settings. The results of implementing this process on 25 thermosonic bonders has reduced the damage to microwave devices by 30% and decreased the wire bond assembly time 25%.
dB pressure level, ultrasonic power node, matte finish, compressional sound waves, capacitive microphone tuning, capacitive bonder tuning
manufacturing engineer at Hewlett-Packard, Microwave Technology Center Division, Santa Rosa, CA