You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.

    If you are an ASTM Compass Subscriber and this document is part of your subscription, you can access it for free at ASTM Compass
    STP850

    The Annealing and Low Temperature Aging Characteristics of Fine Diameter Wire Produced from Dilute Aluminum Alloys

    Published: 01 January 1984


      Format Pages Price  
    PDF (180K) 14 $25   ADD TO CART
    Complete Source PDF (9.7M) 664 $66   ADD TO CART

    Cite this document

    X Add email address send
    X
      .RIS For RefWorks, EndNote, ProCite, Reference Manager, Zoteo, and many others.   .DOCX For Microsoft Word


    Abstract

    Compared are the ultrasonic bonding, annealing and low temperature aging characteristics of one mil Al-1 pct Si, Al-1 pct Mg, and Al-½ pct Mg bonding wires. Ultimate tensile strengths and average bond pull strengths of these three alloys decrease similarly in the 125° to 200°C temperature range, while dissimilarity was observed in elongation: Al-Mg alloys become more ductile and Al-1 pct Si embrittles. Aging to −65°C showed no changes in the mechanical properties of Al-½ pct Mg but caused embrittlement in Al-1 pct Mg, suggesting GP zone formation.

    Keywords:

    Dilute aluminum alloys, microelectronic interconnects, fine diameter wire, ultrasonic bonding, annealing characteristics, low temperature aging, mechanical properties, GP zone formation


    Author Information:

    Hebert, DF
    Semiconductor Packaging/Materials Engineer, Siliconix, Inc., Santa Clara, CA


    Committee/Subcommittee: F01.07

    DOI: 10.1520/STP32672S