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Compared are the ultrasonic bonding, annealing and low temperature aging characteristics of one mil Al-1 pct Si, Al-1 pct Mg, and Al-½ pct Mg bonding wires. Ultimate tensile strengths and average bond pull strengths of these three alloys decrease similarly in the 125° to 200°C temperature range, while dissimilarity was observed in elongation: Al-Mg alloys become more ductile and Al-1 pct Si embrittles. Aging to −65°C showed no changes in the mechanical properties of Al-½ pct Mg but caused embrittlement in Al-1 pct Mg, suggesting GP zone formation.
Dilute aluminum alloys, microelectronic interconnects, fine diameter wire, ultrasonic bonding, annealing characteristics, low temperature aging, mechanical properties, GP zone formation
Semiconductor Packaging/Materials Engineer, Siliconix, Inc., Santa Clara, CA