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Semiconductor devices are known for their sensitivity to particulate contamination during manufacture. This sensitivity is increasing as device features shrink and circuit densities increase. Current VLSI (Very Large Scale Integration) devices are also sensitive to many other forms of contamination besides particles. This paper examines the various forms of contamination and their interactions which affect the yield and performance of VLSI devices.
Contamination forms, VLSI devices, particulate, device manufacturing, device yield
Development Engineer and Manager of New Facilities Contamination Control at the IBM General Technology Division East Fishkill Facility, Hopewell Junction, N.Y.