SYMPOSIA PAPER Published: 01 January 1984
STP30213S

Application of Quantitative Metallography to the Analysis of Grain Growth During Liquid-Phase Sintering

Source

During liquid-phase sintering of iron/copper and various other systems, particle contacts involving grain boundaries with low energy, that is, with large dihedral angles, were frequently observed. By means of electron channeling pattern investigations on a copper/silver system, such low-energy grain boundaries were proved to be low-indexed coincidence boundaries. With the assumption that particle coalescence following the low-energy boundary formation mainly contributes to particle growth, the growth behaviors were treated generally on a statistical basis and then correlated with the special case of iron/copper. Average particle sizes and particle size distributions were calculated and compared with experimental results. It was found that coalescence contributes significantly to particle growth.

Author Information

Petzow, G
Max-Planck-Institut für Metallforschung, Institut für Werkstoffwissenschaften, Stuttgart, West Germany
Takajo, S
Kaysser, WA
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Mass.
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Details
Developed by Committee: E04
Pages: 29–40
DOI: 10.1520/STP30213S
ISBN-EB: 978-0-8031-4905-2
ISBN-13: 978-0-8031-0220-0