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    STP839

    Application of Quantitative Metallography to the Analysis of Grain Growth During Liquid-Phase Sintering

    Published: 01 January 1984


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    Abstract

    During liquid-phase sintering of iron/copper and various other systems, particle contacts involving grain boundaries with low energy, that is, with large dihedral angles, were frequently observed. By means of electron channeling pattern investigations on a copper/silver system, such low-energy grain boundaries were proved to be low-indexed coincidence boundaries. With the assumption that particle coalescence following the low-energy boundary formation mainly contributes to particle growth, the growth behaviors were treated generally on a statistical basis and then correlated with the special case of iron/copper. Average particle sizes and particle size distributions were calculated and compared with experimental results. It was found that coalescence contributes significantly to particle growth.

    Keywords:

    quantitative metallography, liquid-phase sintering, grain growth, coalescence, iron, copper, grain boundaries, metallography


    Author Information:

    Petzow, G
    Professor, Max-Planck-Institut für Metallforschung, Institut für Werkstoffwissenschaften, Stuttgart,

    Takajo, S
    Senior researcher,

    Kaysser, WA
    Visiting scientist, Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Mass.


    Committee/Subcommittee: E04.14

    DOI: 10.1520/STP30213S