SYMPOSIA PAPER Published: 01 January 1977
STP27037S

Hermetic Test Procedures and Standards for Semiconductor Electronics

Source

The hermetic testing of semiconductor devices is a challenging subject area because of the need for leak testing large numbers of sealed packages to very fine leak rates, where the packages are of a wide range of materials and internal volumes. The types of measurement methods to be discussed are those presently in use and are represented in both military and voluntary standards. Four of these methods will be assessed briefly along with the relevant standards as to advantages, disadvantages, range, precision, and agreement. The four methods are bubble, weight gain, helium leak detector, and radioisotope test procedures. Present interlaboratory test efforts that have been undertaken to provide suitable test data for guidance in the drafting of new American Society for Testing and Materials (ASTM) standards will be summarized. Future directions will be indicated.

Author Information

Ruthberg, S
National Bureau of Standards, Washington, D.C.
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Details
Developed by Committee: E07
Pages: 246–259
DOI: 10.1520/STP27037S
ISBN-EB: 978-0-8031-4697-6
ISBN-13: 978-0-8031-0196-8