You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.

    If you are an ASTM Compass Subscriber and this document is part of your subscription, you can access it for free at ASTM Compass

    Fatigue Crack Propagation of Nickel-Base Superalloys at 650°C

    Published: 01 January 1988

      Format Pages Price  
    PDF (460K) 17 $25   ADD TO CART
    Complete Source PDF (27M) 1279 $271   ADD TO CART

    Cite this document

    X Add email address send
      .RIS For RefWorks, EndNote, ProCite, Reference Manager, Zoteo, and many others.   .DOCX For Microsoft Word


    The 650°C fatigue crack propagation behavior of two nickel-base superalloys, René 95 and Waspaloy, were studied with particular emphasis placed on understanding the roles of creep, environment, and two key grain boundary alloying additions, boron and zirconium. Comparison of air and vacuum data showed the air environment to be detrimental over a wide range of frequencies for both alloys. In-depth analysis of René 95 showed that at lower frequencies, such as 0.02 Hz, failure in air occurred by intergranular, environmentally assisted creep crack growth, while at higher frequencies, up to 5.0 Hz, environmental interactions were still evident but creep effects were minimized. The effect of boron and zirconium in Waspaloy was found to be important where environmental and/or creep interactions were present. In those instances, removal of boron and zirconium dramatically increased crack growth. It is therefore plausible that effective dilution of these elements may explain, in part, a previously observed trend in which crack growth rates increased with decreasing grain size.


    nickel-base superalloys, fatigue crack propagation, creep, environment

    Author Information:

    Gayda, J
    NASA-Lewis Research Center, Cleveland, OH

    Gabb, TP
    NASA-Lewis Research Center, Cleveland, OH

    Miner, RV
    NASA-Lewis Research Center, Cleveland, OH

    Committee/Subcommittee: E08.05

    DOI: 10.1520/STP24488S