SYMPOSIA PAPER Published: 01 January 1994
STP23917S

A Model for Primary Creep of 63Sn-37Pb Solder

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A micromechanical model of transient and steady-state creep as it applies to near eutectic Sn-Pb solder is presented. The material is described as a two-phase system having individual material properties, coupled by long-range internal stresses. The constitutive equations permit primary creep and the transition to steady state to be simulated by a numerical analysis in which the global mechanical response is dependent on the local stress state.

The creep equations are calibrated through a series of shear strain measurements of thinwalled tubular solder specimens. Comparisons to predictions include cyclic shear straincontrolled experiments, creep relaxation, and combination ramp-hold shear strain and stress control environments. Application to finite element analysis of surface mount interconnects is described.

Author Information

Schroeder, SA
Rockwell International Science Center, Thousand Oaks, CA
Morris, WL
Rockwell International Science Center, Thousand Oaks, CA
Mitchell, MR
Rockwell International Science Center, Thousand Oaks, CA
James, MR
Rockwell International Science Center, Thousand Oaks, CA
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Details
Developed by Committee: E08
Pages: 82–94
DOI: 10.1520/STP23917S
ISBN-EB: 978-0-8031-5260-1
ISBN-13: 978-0-8031-1994-9