SYMPOSIA PAPER Published: 01 January 1987
STP20028S

Ductility of Plated Metal Films: Its Measurement and Relationship to Microstructure

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The mechanical bulge ductility tester developed previously by the authors (Nakahara et al.) is currently being considered by ASTM as a potential candidate for the standard ductility test apparatus for thin metal films. This paper describes (1) modifications and improvements made recently to the tester, (2) a theoretical analysis of the dependence of measured ductility on the size of the ball used to deform the specimen, and (3) the application of this tester to a study of the relationship between ductility and microstructure for copper films deposited by electroless and electrolytic methods.

Author Information

Nakahara, S
AT&T Bell Laboratories, Murray Hill, NJ
Okinaka, Y
Bell Communications Research, Murray Hill, NJ
Strashil, HK
Bell Communications Research, Murray Hill, NJ
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Details
Developed by Committee: B08
Pages: 32–51
DOI: 10.1520/STP20028S
ISBN-EB: 978-0-8031-5010-2
ISBN-13: 978-0-8031-0947-6