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    STP947

    Ductility of Plated Metal Films: Its Measurement and Relationship to Microstructure

    Published: 01 January 1987


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    Abstract

    The mechanical bulge ductility tester developed previously by the authors (Nakahara et al.) is currently being considered by ASTM as a potential candidate for the standard ductility test apparatus for thin metal films. This paper describes (1) modifications and improvements made recently to the tester, (2) a theoretical analysis of the dependence of measured ductility on the size of the ball used to deform the specimen, and (3) the application of this tester to a study of the relationship between ductility and microstructure for copper films deposited by electroless and electrolytic methods.

    Keywords:

    coatings, ductility, mechanical bulge ductility tester, thin metal films, electroless copper, electrolytic copper


    Author Information:

    Nakahara, S
    Member of technical staff, AT&T Bell Laboratories, Murray Hill, NJ

    Okinaka, Y
    Member of technical staff and consultant, Bell Communications Research, Murray Hill, NJ

    Strashil, HK
    Member of technical staff and consultant, Bell Communications Research, Murray Hill, NJ


    Committee/Subcommittee: B08.01

    DOI: 10.1520/STP20028S