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    Application of Recombination Lifetime Measurements in Silicon Wafer Manufacturing

    Published: 01 January 1998

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    Increasingly stringent demands are being placed on the surface and bulk metal contamination levels of silicon wafer starting material in order to meet ULSI device requirements. Recombination lifetime measurements are applied in silicon wafer manufacturing to monitor metal contamination from various processes including crystal growth, thermal treatments, cleaning processes, epitaxial growth, and to check final product quality. Applications of recombination lifetime measurements in silicon wafer manufacturing are reviewed. Comparisons of recombination lifetime data are made between measurement techniques.


    silicon, recombination lifetime, transition metals, crystal growth, thermal processing, wafer cleaning

    Author Information:

    Seacrist, MR
    Research Engineer, MEMC Electronic Materials Inc, St. Peters, MO

    Committee/Subcommittee: F01.10

    DOI: 10.1520/STP15715S