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    Mechanical Surface Preparation-Grinding

    Published: Jan 2007

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    AFTER SECTIONING AND POSSIBLY MOUNTING, THE METALLOGRAPHIC/materialographic specimen is now to be prepared to obtain the true microstructure or a structure, which, in spite of certain defects (artifacts), will give a true examination result. For a thorough description of artifacts and how to avoid them, see Sections 13.5/6.


    Metallography, Materialography, Preparation methods, Sample preparation, Mechanical polishing, Electrolytic polishing, Cutting, Sectioning, Hot mounting, Cold mounting, Grinding, Polishing, Polishing artifact, Etching, Microscope, Quantitative metallography, Stereology, Vickers hardness, Quality control, Microstructure

    Committee/Subcommittee: E04.01

    DOI: 10.1520/MNL11186M