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    Volume 43, Issue 5 (September 2015)

    Evaluation of the Morphological, Electrical, and Mechanical Properties of Silver Nanopastes

    (Received 17 September 2013; accepted 27 May 2014)

    Published Online: 09 September 2015

    CODEN: JTEVAB

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    Abstract

    This study investigated the sintering behavior of silver nanopastes at 150°C, 180°C, and 210°C. The synthesized silver nanoparticles were dispersed to form ink pastes with 70 wt. % and 80 wt. % silver. The morphology of the sintered silver nanopastes was studied via transmission electron microscopy (TEM), scanning electron microscopy, and x-ray diffraction analyses. Electrical characterization, thermal/humidity aging, and mechanical testing were also performed. Silver nanoparticles were prepared via a chemical reduction method. TEM images revealed particle sizes ranging from 10 nm to 20 nm. Results showed that electrical conductivity could be achieved at 150°C. When the sintered silver nanoparticles were subjected to 1000 h of 85°C/85 % relative humidity testing, a stable resistivity was achieved at a sintering temperature no lower than 210°C. These results showed that a stable network of sintered silver nanoparticles with good mechanical properties could be achieved at 210°C.


    Author Information:

    Durairaj, R.
    Dept. of Mechanical and Materials Engineering, Faculty of Engineering and Science, Universiti Tunku Abdul Rahman (UTAR), Kuala Lumpur,

    Namasivayam, S.
    School of Engineering, Taylor’s Univ., Subang Jaya, Selangor Darul Ehsan

    Zhen Xiong, Chen
    Dept. of Mechanical and Materials Engineering, Faculty of Engineering and Science, Universiti Tunku Abdul Rahman (UTAR), Kuala Lumpur,

    Mannan, Samjid H.
    Dept. of Physics, King’s College London, London,

    Ashayer, Roya
    Dept. of Physics, King’s College London, London,


    Stock #: JTE20130233

    ISSN:0090-3973

    DOI: 10.1520/JTE20130233

    Author
    Title Evaluation of the Morphological, Electrical, and Mechanical Properties of Silver Nanopastes
    Symposium ,
    Committee F01