Published Online: 01 September 1975
| ||Format||Pages||Price|| |
|PDF (240K)||3||$25||  ADD TO CART|
Cite this document
A technique is described for locating and consequently removing submicron particulate matter from semiconductor device wafers. Chemical and structural analyses of these particulates are obtained from energy dispersive X-ray spectra and selected area electron diffraction patterns, respectively.
Advisory engineer, IBM System Products Division—East Fishkill, Hopewell Junction, N.Y.
Stock #: JTE10180J