Published Online: 01 July 1973
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Methods for growing silicon single crystals and then fabricating them into polished wafer form are reviewed. A survey of many of the parameters and measurement techniques needed to specify the polished surface is included. The activities of the Section on the Mechanical Properties of Semiconductor Surfaces are discussed.
IBM System Products Division, East Fishkill, Hopewell Junction, New York
Stock #: JTE10023J