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    Volume 8, Issue 1

    Structural Study and Electrical Properties of Bi1.5–xCaxSb1.5CuO7 Pyrochlore-Type Solid Solution Series

    (Received 28 March 2018; accepted 4 February 2019)

    Published Online: 2019

    CODEN: MPCACD

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    Abstract

    Pyrochlore solid solution Bi, , 1.5, −, x, , , Ca, , x, , Sb, , 1.5, , , CuO, , 7, , , , , has been prepared by conventional ceramic solid state reaction with 0 ≤ x ≤ 0.4. The samples were characterized by X-ray powder diffraction (XRPD), scanning electron microscopy, and electrical conductivity measurements. The pyrochlore single phase formation was confirmed for all of the x-fractions. The variation of the electrical resistivity versus x of all samples measured by means of a four-probe device at room temperature indicates that these still remain insulators. High-temperature electrical conductivity measurements at various frequencies using a device with two electrodes allow us to note the maximum electrical conductivity of 4.7 × 10−3 S.cm−1, which has been reached at x = 0.2, generating an activation energy of 0.14 eV. For this fraction, Rietveld refinement of the corresponding XRPD pattern confirmed the typical cubic Fd-3m space group with a cell parameter of a = 10.4089(1) Å.

    Author Information:

    Dra, Rafik El Arslene
    Laboratoire de Chimie des Matériaux Inorganiques et Applications, Université des Sciences et de la Technologie d’Oran, Faculté de Chimie, Département chimie physique, Oran El-Mnaouer,

    Bekka, Ahmed
    Laboratoire de Chimie des Matériaux Inorganiques et Applications, Université des Sciences et de la Technologie d’Oran, Faculté de Chimie, Département chimie physique, Oran El-Mnaouer,

    Dinnebier, Robert E.
    Max Planck Institute for Solid State Research, Heisenbergstrasse 1, Stuttgart

    Boukerma, Bounekref
    Institut Algérien du Pétrole, Oran (Arzew),


    Stock #: MPC20180057

    ISSN:2379-1365

    DOI: 10.1520/MPC20180057

    Author
    Title Structural Study and Electrical Properties of Bi1.5–xCaxSb1.5CuO7 Pyrochlore-Type Solid Solution Series
    Symposium ,
    Committee D22