Standard Withdrawn, No replacement   Last Updated: Dec 31, 2010 Track Document
ASTM F508-77(2002)

Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008) F0508-77R02 ASTM|F0508-77R02|en-US Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008) Standard new BOS Vol. 10.04 Committee F01
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Scope

1.1 This practice covers the writing of specifications for thick-film pastes for electronics.

1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.

1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.

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