ASTM F72 - 17e1 Standard Specification for Gold Wire for Semiconductor Lead Bonding


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    Referenced ASTM Standards The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    F16 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps

    F205 Test Method for Measuring Diameter of Fine Wire by Weighing

    F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps

    F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire