Research Report RR:D09-1009

    An interlaboratory test program was conducted to determine the precision that would result from the use of a test method for the bondability of insulated wire to potting compounds. This test method is for inclusion in ASTM D3032 on Hookup Wire Insulation. A joint test program was carried out with members of ASTM D9 Subcommittee 16 and the A-2H Committee of the Society of Automotive Engineers participating in specimen preparation and test. Four ASTM members and three A-2H members participated in the program.

    Published: July 1981

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    Related Standards

    D1676-17 Standard Test Methods for Film-Insulated Magnet Wire

    Committee D09 on Electrical and Electronic Insulating Materials