Standard Historical Last Updated: Dec 31, 2010 Track Document
ASTM F68-05

Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices

Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices F0068-05 ASTM|F0068-05|en-US Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices Standard new BOS Vol. 02.01 Committee B05
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Abstract

This specification establishes the requirements for wrought forms and fabricated shapes of oxygen-free copper with UNS No. C10100 suitable for use in electron devices. Specimens shall be appropriately sampled and shall undergo hydrogen embrittlement (reverse bend) test, special macro examination, and special microscopical examination. Materials shall adhere to specified mechanical, dimensional, chemical composition, electrical resistivity, and grain size requirements.

Scope

1.1 This specification establishes the requirements for wrought and fabricated shapes made from Copper UNS No. C10100, conforming to the chemical requirements of Specification B 170, Grade 1, and suitable for use in electron devices.

1.2 The requirements of this specification are in addition to those prescribed in the following product specifications appropriate to the material being ordered: B 1, B 2, B 75, B 75M, B 152/B 152M, B 170, B 187/B 187M, B 272, and B 372. In case of conflict, however, this specification shall take precedence.

1.3 The inch-pound units are the standard for this specification except for grain sizes which are in metric units. Metric values given in parentheses are for information only.

1.4 The following safety hazard caveat applies to sections 17.4, 17.5 and 18.7 of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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Details
Book of Standards Volume: 02.01
Developed by Subcommittee: B05.02
Pages: 6
DOI: 10.1520/F0068-05