Standard Historical Last Updated: Aug 16, 2017 Track Document
ASTM F584-06

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire F0584-06 ASTM|F0584-06|en-US Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire Standard new BOS Vol. 10.04 Committee F01
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Scope

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

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Details
Book of Standards Volume: 10.04
Developed by Subcommittee: F01.07
Pages: 7
DOI: 10.1520/F0584-06
ICS Code: 29.060.10