Standard Historical Last Updated: Mar 14, 2012 Track Document
ASTM F1995-00(2005)

Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch

Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch F1995-00R05 ASTM|F1995-00R05|en-US Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch Standard new BOS Vol. 10.04 Committee F01
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Significance and Use

The different combinations of SMD types, attachment medias, circuit substrates, plating options, and process variation can account for significant variation in test outcome.

The SMD shear strength test is useful to manufacturers and users for determining the bond strength of the component to the membrane switch circuit.

Scope

1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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Details
Book of Standards Volume: 10.04
Developed by Subcommittee: F01.18
Pages: 2
DOI: 10.1520/F1995-00R05
ICS Code: 31.220.20