ASTM B490-92(2003)

    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

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    1. Scope

    1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

    1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

    1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

    1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

    1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    B456 Specification for Electrodeposited Coatings of Copper Plus Nickel Plus Chromium and Nickel Plus Chromium

    UNSPSC Code

    UNSPSC Code

    Referencing This Standard
    Link Here
    Link to Active (This link will always route to the current Active version of the standard.)

    DOI: 10.1520/B0490-92R03

    Citation Format

    ASTM B490-92(2003), Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits, ASTM International, West Conshohocken, PA, 2003,

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