Subcommittee F01.03 on Metallic Materials, Wire Bonding, and Flip Chip

    Showing results 1-32 of 32 matching ACTIVE standards under the jurisdiction of F01.03     F01 Home

    F7-95(2021) Standard Specification for Aluminum Oxide Powder

    F15-04(2017) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy

    F16-12(2017) Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps

    F18-12(2017) Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

    F19-21 Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals

    F29-97(2017) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications

    F30-96(2017) Standard Specification for Iron-Nickel Sealing Alloys

    F31-16 Standard Specification for Nickel-Chromium-Iron Sealing Alloys

        See also WK75371 proposed revision

    F44-21 Standard Specification for Metallized Surfaces on Ceramic

    F72-21 Standard Specification for Gold Wire for Semiconductor Lead Bonding

    F73-96(2017) Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps

    F83-71(2018) Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters

    F85-76(2018) Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes

    F96-77(2020) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms

    F106-12(2017) Standard Specification for Brazing Filler Metals for Electron Devices

    F180-94(2020) Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices

    F204-76(2018) Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire

    F205-94(2020) Standard Test Method for Measuring Diameter of Fine Wire by Weighing

    F219-96(2018) Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps

    F256-05(2020) Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium

    F269-60(2019) Standard Test Method for Sag of Tungsten Wire

    F288-96(2019) Standard Specification for Tungsten Wire for Electron Devices and Lamps

    F289-96(2019) Standard Specification for Molybdenum Wire and Rod for Electronic Applications

    F290-94(2020) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals

    F364-96(2019) Standard Specification for Molybdenum Flattened Wire for Electron Tubes 

    F375-20 Standard Specification for Integrated Circuit Lead Frame Material

    F458-13(2018) Standard Practice for Nondestructive Pull Testing of Wire Bonds

    F459-13(2018) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

    F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding

    F1269-13(2018) Standard Test Methods for Destructive Shear Testing of Ball Bonds

    F1466-20 Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications

    F1684-06(2021) Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications

    0 matching Proposed New Standards under the jurisdiction of F01.03     F01 Home

    Showing Results 1-13 of 13 matching WITHDRAWN standards under the jurisdiction of F01.03     F01 Home

    F1-03 Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes (Withdrawn 2009)

    F3-02a Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)

    F4-66(2005) Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)

    F23-90(1995)E01 Guide for Selecting Methods of Temperature Measurement of Thermionic Emitters (Withdrawn 2001)

    F78-97(2002) Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)

    F97-72(2002)e1 Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008)

    F111-96(2002) Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters (Withdrawn 2008)

    F357-78(2002) Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)

    F508-77(2002) Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

    F692-97(2002) Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)

    F798-97(2002) Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)

    F816-83(2003) Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)

    F979-86(2003) Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)