Committee F01 on Electronics

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    Subcommittees and Standards

    Standards under the jurisdiction of F01

    Each main committee in ASTM International is composed of subcommittees that address specific segments within the general subject area covered by the technical committee. Click on the subcommittee links below to see the title of existing standards for each subcommittee. Then, click on the resulting titles to see the standard's scope, referenced documents, and more.

    F01.03 Metallic Materials, Wire Bonding, and Flip Chip
    F01.10 Contamination Control
    F01.11 Nuclear and Space Radiation Effects
    F01.15 Compound Semiconductors
    F01.17 Sputter Metallization
    F01.18 Printed Electronics
    F01.90 Executive
    F01.95 Reference Materials