WITHDRAWN, NO REPLACEMENT
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The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package.
Formerly under the jurisdiction of Committee F01 on Electronics and Subcommittee F01.03 on Metallic Materials, this test method was withdrawn in May 2009 with no replacement because the committee is not aware of the need to maintain the standard. Reference to the standard will remain available, but at this time, the committee does not wish to actively maintain the standard.
1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package.
1.2 This test method covers a test for leaks in a package that is intended to be hermetically sealed after hybrid circuit assembly. Various types of hybrid packages may be tested by this test method. The test method is nondestructive and therefore suitable for 100% inspection.
1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety problems associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
Federal StandardFed. Std. No. 209 Clean Room and Work Station Requirements, Controlled Environment
ASTM F979-86(2003), Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009), ASTM International, West Conshohocken, PA, 1998, www.astm.orgBack to Top