1.1 This practice covers the measurement of the response of linear integrated circuits, under given operating conditions, to pulsed ionizing radiation. The response may be either transient or more lasting, such as latchup. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.
1.3 The test may be considered to be destructive either for further tests or for other purposes if the total radiation dose exceeds some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test. (See 6.10.)
1.4 Setup, calibration, and test circuit evaluation procedures are included in this practice.
1.5 Procedures for lot qualification and sampling are not included in this practice.
1.6 Because response varies with different device types, the dose rate range for any specific test is not given in this practice but must be agreed upon by the parties to the test.
1.7 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific hazard statement is given in 7.9.2.
Circuitry; Current measurement-semiconductors; Destructive testing-semiconductors; Dose rate threshold; Dosimetry; Electrical conductors-semiconductors; Electron linear accelerator; Flash x-ray machines (FXR); Integrated circuits; Ionizing radiation; Irradiance/irradiation-semiconductors; Lasers and laser applications; Linear threshold voltage; Radiation exposure-electronic components/devices; Total dose; Voltage; dose rate response of linear integrated circuits, practice;
Citing ASTM Standards
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