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This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections.
Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in January 2015 in accordance with section 10.6.3 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, ( 3) high-strength wire, and (4) special purpose wire. Note 1Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties or both. This practice is known variously as "modifying," "stabilizing," or "doping." The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, "high-strength" and "special purpose" wire, the identity of modifying additives is not restricted.
1.2 The values stated in SI units shall be regarded as the standard.
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
E16 Method of Free Bend Test for Ductility of Welds
F205 Test Method for Measuring Diameter of Fine Wire by Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
ASTM F72-06, Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015), ASTM International, West Conshohocken, PA, 2006, www.astm.orgBack to Top