Formerly under the jurisdiction of Committee F01 on Electronics, this practice was withdrawn in June 2008 in accordance with section 10.5.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.
1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.
1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.
1.3 This test method applies to all films that can be soldered.
1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.
1.5 This test method is destructive.
1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
adhesion strength; metallization; solderable thick film;
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Citing ASTM Standards
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