This specification establishes the requirements for wrought forms and fabricated shapes of oxygen-free copper with UNS No. C10100 suitable for use in electron devices. Specimens shall be appropriately sampled and shall undergo hydrogen embrittlement (reverse bend) test, special macro examination, and special microscopical examination. Materials shall adhere to specified mechanical, dimensional, chemical composition, electrical resistivity, and grain size requirements.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1.1 This specification establishes the requirements for wrought and fabricated shapes made from Copper UNS No. C10100, conforming to the chemical requirements of Specification B170, Grade 1, and suitable for use in electron devices.
1.2 The requirements of this specification are in addition to those prescribed in the following product specifications appropriate to the material being ordered: B1, B2, B3, B75, B75M, B152/B152M, B170, B187/B187M, , B272, and B372. In case of conflict, however, this specification shall take precedence.
1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.3.1 Exception—grain sizes are in metric units and are standard.
1.4 The following safety hazard caveat applies to sections 17.4, 17.5 and 18.7 of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
B1 Specification for Hard-Drawn Copper Wire
B2 Specification for Medium-Hard-Drawn Copper Wire
B3 Specification for Soft or Annealed Copper Wire
B75 Specification for Seamless Copper Tube
B75M Specification for Seamless Copper Tube (Metric)
B152/B152M Specification for Copper Sheet, Strip, Plate, and Rolled Bar
B170 Specification for Oxygen-Free Electrolytic Copper--Refinery Shapes
B187/B187M Specification for Copper, Bus Bar, Rod, and Shapes and General Purpose Rod, Bar, and Shapes
B188 Specification for Seamless Copper Bus Pipe and Tube
B193 Test Method for Resistivity of Electrical Conductor Materials
B272 Specification for Copper Flat Products with Finished (Rolled or Drawn) Edges (Flat Wire and Strip)
B372 Specification for Seamless Copper and Copper-Alloy Rectangular Waveguide Tube
B577 Test Methods for Detection of Cuprous Oxide (Hydrogen Embrittlement Susceptibility) in Copper
B846 Terminology for Copper and Copper Alloys
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E112 Test Methods for Determining Average Grain Size
E527 Practice for Numbering Metals and Alloys in the Unified Numbering System (UNS)
oxygen-free copper; oxygen-free copper for electron devices; wrought copper forms for electron devices; wrought oxygen-free copper for electron devices; Copper alloy plate/sheet/strip/rolled bar--specifications; Copper alloy rod/bar/shapes--specifications; Copper alloy tube--specifications; Copper electrical conductors--specifications; Copper rod/bar/shapes--specifications; Copper tube--specifications; Electronic materials/applications (Cu/Cu alloys)--specifications; Metal electronic components/devices--specifications; Microscopic examination--electronic materials; Oxygen-free (deoxidized) copper; UNS C10100 (oxygen-free copper); Waveguides; Wrought Cu/Cu-alloy materials/applications
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