Abstract
This specification establishes the requirements for wrought forms and fabricated shapes of oxygen-free copper with UNS No. C10100 suitable for use in electron devices. Specimens shall be appropriately sampled and shall undergo hydrogen embrittlement (reverse bend) test, special macro examination, and special microscopical examination. Materials shall adhere to specified mechanical, dimensional, chemical composition, electrical resistivity, and grain size requirements.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1. Scope
1.1 This specification establishes the requirements for wrought and fabricated shapes made from Copper UNS No. C10100, conforming to the chemical requirements of Specification B 170, Grade 1, and suitable for use in electron devices.
1.2 The requirements of this specification are in addition to those prescribed in the following product specifications appropriate to the material being ordered: B 1, B 2, B 75, B 75M, B 152/B 152M, B 170, B 187/B 187M, B 272, and B 372. In case of conflict, however, this specification shall take precedence.
1.3 The inch-pound units are the standard for this specification except for grain sizes which are in metric units. Metric values given in parentheses are for information only.
1.4 The following safety hazard caveat applies to sections 17.4, 17.5 and 18.7 of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents
ASTM Standards
B1 Specification for Hard-Drawn Copper Wire
B152/B152M Specification for Copper Sheet, Strip, Plate and Rolled Bar
B170 Specification for Oxygen-Free Electrolytic Copper--Refinery Shapes
B187/B187M Specification for Copper Bar, Bus Bar, Rod and Shapes
B188 Specification for Seamless Copper Bus Pipe and Tube
B193 Test Method for Resistivity of Electrical Conductor Materials
B2 Specification for Medium-Hard-Drawn Copper Wire
B248 Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip and Rolled Bar
B248M Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip and Rolled Bar [Metric]
B249/B249M Specification for General Requirements for Wrought Copper and Copper-Alloy Rod, Bar, Shapes, and Forgings
B250/B250M Specification for General Requirements for Wrought Copper-Alloy Wire
B272 Specification for Copper Flat Products with Finished (Rolled or Drawn) Edges (Flat Wire and Strip)
B3 Specification for Soft or Annealed Copper Wire
B372 Specification for Seamless Copper and Copper-Alloy Rectangular Waveguide Tube
B577 Test Methods for Detection of Cuprous Oxide Hydrogen Embrittlement Susceptibility in Copper
B75 Specification for Seamless Copper Tube
B75M Specification for Seamless Copper Tube (Metric)
E112 Test Methods for Determining Average Grain Sizes
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E527 Practice for Numbering Metals and Alloys (UNS)
Index Terms
oxygen-free copper; oxygen-free copper for electron devices; wrought copper forms for electron devices; wrought oxygen-free copper for electron devices; Copper alloy plate/sheet/strip/rolled bar--specifications; Copper alloy rod/bar/shapes--specifications; Copper alloy tube--specifications; Copper electrical conductors--specifications; Copper rod/bar/shapes--specifications; Copper tube--specifications; Electronic materials/applications (Cu/Cu alloys)--specifications; Metal electronic components/devices--specifications; Microscopic examination--electronic materials; Oxygen-free (deoxidized) copper; UNS C10100 (oxygen-free copper); Waveguides; Wrought Cu/Cu-alloy materials/applications
DOI: 10.1520/F0068-05E01

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