Fluids and greases in contact with encapsulating compounds may adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications.

This test method provides a means for measuring the effect of fluids and greases on various encapsulants.

This test method is intended for use in research and evaluation.

1. Scope

1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.

Note 1—To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms “weight” and “weigh” are used in this test method although the units of measurement are those of mass.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.

1.3 The values stated in SI units are standard. The values in parentheses are for information only.

Note 2—There is no similar or equivalent IEC standard.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

Index Terms

electronic; encapsulating compound; grease; microelectronics; Electronic encapsulants; Electronic materials/applications; Fluid resistance; Grease resistance; Microelectronic devices

ICS Code

Citing ASTM Standards

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