Standards

ASTM F677 - 13


ASTM F677 - 13 Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications


Active Standard ASTM F677 Developed by Subcommittee: D09.01 |Book of Standards Volume: 10.02

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ASTM F677

Significance and Use

5.1 Fluids and greases in contact with encapsulating compounds have the potential to adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications.

5.2 This test method provides a means for measuring the effect of fluids and greases on various encapsulants.

5.3 This test method is intended for use in research and evaluation.

1. Scope

1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.

Note 1To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms “weight” and “weigh” are used in this test method although the units of measurement are those of mass.

1.2 The values stated in SI units are standard. The values in parentheses are for information only.

Note 2There is no similar or equivalent IEC standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.


2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

D1193 Specification for Reagent Water

D1711 Terminology Relating to Electrical Insulation

D5423 Specification for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation

D6054 Practice for Conditioning Electrical Insulating Materials for Testing



Keywords

electronic; encapsulating compound; grease; microelectronics ;



ICS Code



DOI: 10.1520/F0677-13

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