ASTM F638-88(2001)

    Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

    Withdrawn Standard: ASTM F638-88(2001) | Developed by Subcommittee: F01.07

    WITHDRAWN, NO REPLACEMENT


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    Withdrawn Rationale:

    This specification covers aluminum-1 % magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

    This specification is being withdrawn because no fine-wire with magnesium, at any concentration, is being sold or made in the world.

    Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in January 2006.

    1. Scope

    1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

    1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.



    Referencing This Standard

    DOI: 10.1520/F0638-88R01

    ASTM International is a member of CrossRef.

    Citation Format

    ASTM F638-88(2001), Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006), ASTM International, West Conshohocken, PA, 2001, www.astm.org

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