Developed by Subcommittee: F01.07
WITHDRAWN, NO REPLACEMENT
This specification covers standard formats for testable semiconductor lead carrier tape suitable for hybrid applications.
This specification is being withdrawn because the industry has abandoned the use of the methods described in this specification.
Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in January 2006.
1.1 This specification covers standard formats for testable semiconductor lead carrier tape suitable for hybrid applications.
1.2 This standard specifies tape width, configuration, and location of guide perforations ("sprocket holes"), location of lead pattern frames on tape, lead pattern window size, and placement of outer lead bond and electrical test pad areas in the lead pattern.
1.3 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.4 The following hazard caveat pertains only to the test method portion, Section 7 of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.