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    ASTM F584-06e1

    Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)

    Withdrawn Standard: ASTM F584-06e1 | Developed by Subcommittee: F01.07

    WITHDRAWN, NO REPLACEMENT


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    Withdrawn Rationale:

    This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

    Formerly under the jurisdiction of Committee F01 on Electronics, this practice was withdrawn in January 2015 in accordance with section 10.6.3 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

    1. Scope

    1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

    1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

    1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

    1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

    This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.



    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    F72 Specification for Gold Wire for Semiconductor Lead Bonding

    F487 Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding

    Federal Standard

    Fed. Std. No. 209B Clean Room and Work Station Requirements, Controlled Environment

    ASTM Adjunct

    Spool inspection jig (4 drawings and description)


    Referencing This Standard

    DOI: 10.1520/F0584-06E01

    ASTM International is a member of CrossRef.

    Citation Format

    ASTM F584-06e1, Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015), ASTM International, West Conshohocken, PA, 2006, www.astm.org

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