ASTM F542-07

    Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)

    Withdrawn Standard: ASTM F542-07 | Developed by Subcommittee: D09.01

    WITHDRAWN, NO REPLACEMENT


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    Withdrawn Rationale:

    This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

    Formerly under the jurisdiction of Committee D09 on Electrical and Electronic Insulating Materials, this test method was withdrawn in August 2009. This standard is being withdrawn without replacement due to its limited use by industry.

    1. Scope

    1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

    1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.

    This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.

    Note 1

    There is no equivalent IEC standard.



    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    D1711 Terminology Relating to Electrical Insulation

    D5423 Specification for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation


    Referencing This Standard

    DOI: 10.1520/F0542-07

    ASTM International is a member of CrossRef.

    Citation Format

    ASTM F542-07, Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013), ASTM International, West Conshohocken, PA, 2007, www.astm.org

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