Formerly under the jurisdiction of Committee F01 on Electronics, this practice was withdrawn in June 2008 in accordance with section 10.5.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.
1.1 This practice covers the writing of specifications for thick-film pastes for electronics.
1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.
1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.
hybrid microcircuits; reliability; solderability; thick films;
ASTM International is a member of CrossRef.
Citing ASTM Standards
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