Active Standard ASTM F487 | Developed by Subcommittee: F01.07
Book of Standards Volume: 10.04
Historical (view previous versions of standard)
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
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1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
F16 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F72 Specification for Gold Wire for Semiconductor Lead Bonding
F205 Test Method for Measuring Diameter of Fine Wire by Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
Military StandardMIL-STD-105 Sampling Procedures and Tables for Inspection by Attributes
ICS Number Code 29.060.10 (Wires)
UNSPSC Code 32111700(Semiconductor devices)