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This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
F16 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
Military StandardMIL-STD-105 Sampling Procedures and Tables for Inspection by Attributes
ICS Number Code 29.060.10 (Wires)
UNSPSC Code 32111700(Semiconductor devices)
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ASTM F487-13, Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding, ASTM International, West Conshohocken, PA, 2013, www.astm.orgBack to Top