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Significance and Use
5.1 Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to distinguish between weak, nonadherent wire bonds and acceptably strong wire bonds. The methods are destructive.
5.2 These test methods are appropriate for on-line use for process control, for purchase specifications, and for research in support of improved yield or reliability. The referee method should be used for quantitative comparison of pull strengths of wire bonds.
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.
1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2
1.5 A nondestructive procedure is described in Practice F458.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
F458 Practice for Nondestructive Pull Testing of Wire Bonds
ICS Number Code 29.120.20 (Connecting devices)
UNSPSC Code 11101705(Aluminum)
ASTM F459-13, Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds, ASTM International, West Conshohocken, PA, 2013, www.astm.orgBack to Top