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Significance and Use
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-μm)) wire such as the type used in integrated circuits and hybrid microcircuits, system in package, and so forth.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25 of the sample average, x. If s > 0.25 x, this practice may not be used.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.8 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
F459 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Military StandardMIL-STD-883 Method 2023
ICS Number Code 29.120.20 (Connecting devices)
UNSPSC Code 32101600(Integrated circuits)