1.1 This test method covers the determination of the biaxial flexure strength (modulus of rupture) of thin ceramic substrates.
1.2 This test method is applicable to specimens in the as-fired condition or to test pieces prepared to have a certain thickness or surface finish.
1.3 This test method may be used with specimens of various thicknesses and having warpage; no limits are placed on the latter, except those mutually imposed by the specifications agreed upon between the manufacturer and the purchaser of the substrates.
1.4 The values stated in inch-pound units are to be regarded as the standard. The metric equivalents of inch-pound units may be approximate.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Biaxial flexure strength; Ceramic materials-electrical/electronic devices; Electrical conductors-semiconductors; Electronic materials/applications-ceramics; Flexural strength; Modulus of rupture (MOR); biaxial flexure strength (modulus of rupture) of ceramic substrates;
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Citing ASTM Standards
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