Significance and Use
This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon between the parties concerned.
This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in copper. The objective is to improve laboratory-to-laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data.
For most metallic species, the detection limit for routine analysis is on the order of 0.01 wt. ppm. With special precautions, detection limits to sub-ppb levels are possible.
This test method may be used as a referee method for producers and users of electronic-grade copper materials.
1.1 This test method covers the concentrations of trace metallic impurities in high purity (99.95 wt. % pure, or purer, with respect to metallic trace impurities) electronic grade copper.
1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS).
1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of detection limits, and the like) known by the responsible technical committee to effect the reliability of high purity copper analyses.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
E135 Terminology Relating to Analytical Chemistry for Metals, Ores, and Related Materials
E173 Practice for Conducting Interlaboratory Studies of Methods for Chemical Analysis of Metals
E180 Practice for Determining the Precision of ASTM Methods for Analysis and Testing of Industrial and Specialty Chemicals
E691 Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
E876 Practice for Use of Statistics in the Evaluation of Spectrometric Data
F1593 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer
copper; electronics; glow discharge mass spectrometer (GDMS); purity analysis; sputtering target; trace metallic impurities; Copper; Glow discharge mass spectrometer (GDMS); Purity analysis; Sputtering process/targets; Trace metallic impurities ;
ICS Number Code 77.120.30 (Copper and copper alloys)
ASTM International is a member of CrossRef.
Citing ASTM Standards
[Back to Top]