This specification sets purity grade levels, physical attributes, analytical methods, and packaging of three grades of pure unalloyed aluminum source materials for electronic thin film applications such as evaporation sources and sputtering targets. The impurity levels should be analyzed using the proposed method and should be within the specified range for each grade.

This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

1. Scope

1.1 This specification covers pure aluminum metal (unalloyed) for use in evaporation sources and sputtering targets. This material is intended as a raw material for electronic applications. The material is used as-supplied in some cases (for example, as e-beam evaporation sources). In other instances it may be remelted, alloyed, cast and processed by the purchaser to make finished products (for example, sputtering targets).

1.2 This specification sets purity grade levels, physical attributes, analytical methods, and packaging.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

D1971 Practices for Digestion of Water Samples for Determination of Metals by Flame Atomic Absorption, Graphite Furnace Atomic Absorption, Plasma Emission Spectroscopy, or Plasma Mass Spectrometry

Keywords

aluminum; coating; evaporation; sputtering; targets; thin films; vacuum coating; Aluminum electrical conductors (semiconductors); Electronic materials/applications--specifications; Electronic thin-film applications--specifications; Evaporators/evaporation--specifications; Sputtering process/targets--specifications; Targets; Vacuum electronic applications;

ICS Code

ICS Number Code 31.200 (Integrated circuits. Microelectronics)

Citing ASTM Standards

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