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Significance and Use
5.1 Failure of microelectronic devices is often due to the failure of an interconnection bond. The most common type of interconnection bond is the thermosonic gold or copper wire bond. A very important element of this interconnection is the first bond or ball bond. These test methods can assist in maintaining control of the process for making ball bonds. They can be used to distinguish between weak and nonadherent ball bonds, of both, and bonds that are acceptably strong.
5.2 These test methods are appropriate for on-line use in process control, for process development, for purchase specifications, and for research in support of improved yield and reliability. Since the ball shearing method tests only the first bond in a microelectronic wire bond interconnection system, it must be used in a complementary fashion5 ,6 with the wire bond pull test.3
1.2 These test methods cover ball bonds made with small diameter (from 18 to 76-μm (0.0007 to 0.003-in.)) gold or copper wire of the type used in integrated circuits and hybrid microelectronic assemblies, system on a chip, and so forth.
1.3 These test methods can be used only when the ball height and diameter are large enough and adjacent interfering structures are far enough away to allow suitable placement and clearance (above the bonding pad and between adjacent bonds) of the shear test ram.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
F458 Practice for Nondestructive Pull Testing of Wire Bonds
F459 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
NIST DocumentsIOLMClassM2-Circular Precision Laboratory Standards of Mass and Laboratory Weights
Military StandardMIL-STD883, Method 2010
ICS Number Code 25.160.40 (Welding joints and welds)
UNSPSC Code 32101600(Integrated circuits)