1. Scope
1.1 This test method covers wafers composed of silicon and other materials used in the semiconductor industry.
1.2 The test method is used to determine the mass of organic (oxidizable) carbon deposited on all exposed wafer surfaces. It is not used to determine total carbon content of the wafer material.
1.3 This test method is limited to carbon determinations in the range from 0.1 to 50 [mu]g/sample. The detection limit is defined as 2 X standard deviation (2[sigma]).
1.4 Volatiles may be lost during storage or handling, or both, of wafers. This test method is not used to quantify volatile organic compounds.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Keywords
Carbon content-semiconductors; Contamination-semiconductors; Electrical conductors-semiconductors; Microelectronics industry; Organic carbon (OC); Oxidizable carbon; Persulfate oxidation; Semiconductor device testing; Silicon semiconductors; Silicon semiconductors-slices/wafers; wafer surfaces-mass of deposited organic (oxidizable) carbon; contaminants, by persulfate oxidant solution, test
Citing ASTM Standards
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