| ||Format||Pages||Price|| |
|PDF Version||4||$37.00||  ADD TO CART|
|Print Version||4||$37.00||  ADD TO CART|
This practice is intended to control the quality and repeatability of the radiological examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. However, this practice is not intended to control the acceptability or quality of the electronic devices imaged. The quality of the radiological examination shall be determined by image quality indicators (IQIs), which shall be manufactured from clear acrylic plastic with steel covers serving as shims, lead spheres, gold or tungsten wires, and lead numbers, and shall be permanently identified with the appropriate IQI number. The IQI shall simulate as closely as possible the device being examined. For example, the IQI shall have a radiographic density or grey level nearest to that of the device being examined. Two IQIs shall be used for each radiograph, with each IQI located at diagonally opposite corners of the film, and the radiographic image free of blemishes. To identify the image, in both radiography and radioscopy, a system of positive identification of the image shall be provided, which may include any or all of the following: the name of examining laboratory, the date, the part number, the serial number, the data code, the view, and whether original or subsequent exposure.
This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.
1.1 This practice relates to the radiological examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiological images and are not intended for controlling the acceptability or quality of the electronic devices imaged.
Note 1—Refer to the following publications for pertinent information on methodology and safety and protection: Guides E94 and E1000, and “General Safety Standard for Installation Using Non-Medical X Ray and Sealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and Use,” Handbook No. 114.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
E94 Guide for Radiographic Examination
E543 Specification for Agencies Performing Nondestructive Testing
E1000 Guide for Radioscopy
E1255 Practice for Radioscopy
E1316 Terminology for Nondestructive Examinations
ICS Number Code 19.100 (Non-destructive testing)