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ASTM E671 - 98(2010)


ASTM E671 - 98(2010) Standard Specification for Maximum Permissible Thermal Residual Stress in Annealed Glass Laboratory Apparatus


Active Standard ASTM E671 Developed by Subcommittee: E41.01 |Book of Standards Volume: 14.04

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ASTM E671

Abstract

This specification covers a limit for thermal residual stress in reusable annealed glass laboratory apparatus as determined by prescribed photoelastic measurement procedures. This specification recognizes that photoelastic measurements are proportional to the difference of the principal stresses. The stress limit shall be measured and calculated to meet the specified requirements.

This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

1. Scope

1.1 This specification covers a limit for thermal residual stress in reusable annealed glass laboratory apparatus as determined by prescribed photoelastic measurement procedures.


2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

E1157 Specification for Sampling and Testing of Reusable Laboratory Glassware

E1273 Specification for Color Coding of Reusable Laboratory Pipets

F218 Test Method for Measuring Optical Retardation and Analyzing Stress in Glass



Keywords

annealed glass; residual; stress; Annealed glass--specifications; Friedel (Senarmont) polarimeter; Laboratory apparatus--specifications; Photoelastic measurement; Polarimeter method; Residual stress; Senarmont polarimeter; Stress--glass materials/applications; Thermal analysis (TA); Thermal process/properties; Stress cracking tests;



ICS Code

ICS Number Code 71.040.20 (Laboratory ware and related apparatus)



DOI: 10.1520/E0671-98R10

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